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The 2020 4th International Conference on Smart Materials and Structural Engineering (ICSMSE2020)

Important Information

Website URL: http://www.icsmse.org/zhongwen 

Start Date / End Date: February 28-1,2020

Submission Deadline:  February 28, 2020

1.About the conference:

The 2020 4th International Conference on Smart Materials and Structural Engineering (ICSMSE 2020) will be held on February 28-01, 2020 in Zhuhai, China. ICSMSE 2020 is to bring together innovative academics and industrial experts in the field of Smart Materials and Structural Engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in Smart Materials and Structural Engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Smart Materials and Structural Engineering and related areas.

2.Conference Chairman

Prof. Weihua Li   Dean of the School of Chemical Engineering and Technology, Sun Yat-sen University/ Researcher of Institute of oceanology, Chinese Academy of Sciences

Honorary Title:

The National Science Fund for Distinguished Young Scholars

National “ten thousand talents plan” leading talents

Young and middle-aged innovation leaders of the Ministry of Science and Technology.

Research Field:

Mainly engaged in marine corrosion and protection research, Based on the needs of national marine strategy, the purpose of the research work is to focus on the corrosive mechanism of marine materials in harsh marine environment, functional protective materials, and research on the frontier and innovation of new technology on defense regulation and control through comprehensive means of different scales and interdisciplinary intersections.


- Submit to the Conference

All submissions will be peer reviewed, and the accepted papers will be published in the Key Engineering Materials (ISSN: 1662-9795), indexed by Elsevier: SCOPUS, Ei Compendex (CPX).


*All submissions must not be less than 5 pages in length and papers should be submitted to  AIS SUBMISSION SYSTEM


Selected papers will be recommended to SCI Journals.



Journal of Materials Science: Materials in Electronics(ISSN:0957-4522,IF=2.195)

4. Call For Papers

(1) Materials Science and Engineering

(2) Material and Structure

(3) Materials Properties, Measuring Methods and Applications

(4) Research on methods of material Research, Analysis and Modeling

(5) Manufacture and Processing of Materials

(6) Structural Engineering

(7) More Related Topics


5.Submission Guides

Please upload the full paper(word+pdf) to AIS SUBMISSION SYSTEM

1. The submitted papers must not be under consideration elsewhere. 

2. Please submit the full paper, if presentation and publication are both needed. 

3. 4Please submit the abstract only, if you just want to make presentations.   

4. All submission must not be less than 5 pages in length.



Registration fee (By US Dollar)

Regular Registration(5pages)

470 USD / per paper

Additional Paper(5 pages)

450 USD / per paper

Extra Pages (Begin at Page 6)

50 USD / per extra page

Attendees without Papers

230 USD / per person

Attendees without Papers (Groups)

200USD / per person(≥ 3  persons)

Purchase Extra Journal

75 USD / book


7.Contact Us

Conference Secretary: Ms. Yao

E-mail: ICSMSE2020@126.com

Tel: +86-13922159104

WeChat: 13922159104

QQ: 1406807373

Website: http://www.icsmse.org/

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